전문화된 인력과 전문 장비를 통한 문제점 해결 분석 서비스

전기, 전자, 항공, 및 자동차 전장품 등과 같은 제품에 대하여 사용(Field) 또는 공정(Process) 중 고장이 발생될 수 있습니다. 이에 대한 고장원인을 규명해야신속한 대응 및 개선을 할 수 있습니다.

디티앤씨는 전문화된 인력과 전문 분석장비를 통해 여러 분야에 대한 제품 분석 및 고장분석(Failure Analysis)을 통해 문제점에 대한 개선 방향을 제공하고있습니다.

[ 분석분야 ]

1) 반도체 고장분석 (Semiconductor Analysis)

- V-I Curve Analysis (Open Short Analysis)

- De-Capsulation Analysis (EOS, ESD, Wire Bond Open etc,)

- C-SAM Analysis (EMC Delamination Analysis)

2) PCB 부품 고장분석 (PCB Analysis)

- Via Hole Crack Analysis

- Pattern Short & Inner Pattern Delamination Analysis

- Dendrite Short & Pattern Bunt Analysis

- Pattern Defect (De-wetting, Delamination, Black Pad etc.)

3) 솔더부 고장분석 (Solderability Analysis)

- ES 90000-04, MS 184-01 Analysis (Whiskr & Migration etc.)

- Intermetallic Compound Analysis

- Solder Crack & Delamination Analysis

4) 재료 고장 분석 (Material Analysis)

- Fracture Analysis (Ductile Fracture, Brittle Fracture etc.)

- Material Analysis (SUS Structure, Aluminum Structure etc,)

- Grin Boundary Analysis (Iron Carbide, Body Centered Tetragonal Iron etc,)

5) 자동차 전장품 분석 (HKMC ES, GMW, FORD Spec Analysis)

- ES 90000-01 Solder 외관판정 분석

- ES 90000-02 반도체 박리 평가 분석

- ES 90000-03 PCB 회로소자 정밀 분석

- ES 90000-04 무연솔더 평가 기준

- ES 900000-05, 06 HALT, HAST 가속내구시험

- ES 91500-00,02,03 자동차 전장용 커넥터 평가 기준

- ES 95400-10 전자기기 전자회로 분석 등.

- MS Spec Analysis : Solder Paste 재료분석, Plastic 및 CCL평가, VOC & 납조성 유해성 검사

- GMW 3172 Solder Intermetallic & Solderability 분석 등.